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BYD Overhauls Payment System as China Tightens Oversight

Published: Dec. 5, 2025  6:57 p.m.  GMT+8
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China’s BYD Co. Ltd. (002594.SZ) is dismantling a massive digital payment system used to settle obligations to suppliers, marking a major shift in the country’s trillion-yuan shadow receivables market following a sweeping regulatory crackdown, Caixin has learned.

Since 2018, BYD has increasingly relied on Di Lian (迪链) vouchers — digital receivables certificates backed by the automaker’s own credit — as a key method of settling payments to suppliers. These instruments circulated within BYD’s vast supplier network or were discounted for cash, often through a factoring firm affiliated with BYD.

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  • BYD is dismantling its Di Lian digital payment system, which issued over 400 billion yuan ($57 billion) in vouchers to suppliers since 2018.
  • Regulatory crackdowns require BYD to phase out Di Lian within 2-3 years, shifting to cash or standardized bills, to protect SMEs and limit shadow financing.
  • This shift accelerates supplier payments, matches new rules for large enterprises, and reflects broader moves to curb China’s shadow receivables market.
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Who’s Who
BYD Co. Ltd.
BYD Co. Ltd. (比亚迪) is a Chinese automaker that is dismantling its "Di Lian" digital payment system, which issued digital receivables certificates backed by BYD's credit. This system, with over 400 billion yuan issued by mid-2023, allowed BYD to delay cash outflows to suppliers. Due to new regulations, BYD is phasing out Di Lian and shifting to cash payments and standardized bills.
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What Happened When
Since 2018:
BYD increasingly relied on Di Lian vouchers as a key method of settling payments to suppliers.
By mid-2023:
Cumulative Di Lian issuance exceeded 400 billion yuan ($57 billion).
2025:
China’s central bank and several other agencies issued rules imposing strict limits on digital receivables and defining relevant corporate platforms as information intermediaries, not financing vehicles, with a two-year transition period for compliance.
2025:
BYD issued four tranches of technological innovation bonds totaling 20 billion yuan.
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