Biren Unveils 1,024-GPU Optical Super Node Architecture

Hong Kong-listed chipmaker Shanghai Biren Intelligent Technology Co. has unveiled a next-generation architecture capable of interconnecting up to 1,024 graphics processing units (GPUs), adopting advanced optical connections to power massive artificial intelligence workloads.

The solution, showcased at the World Artificial Intelligence Conference, integrates optical engines directly onto the company’s upcoming BR2xx series boards using near-packaged optics (NPO). By physically separating computing and networking nodes, the design allows for standard server deployments — eliminating the need for customized racks and drastically shortening product development cycles.