Taiwan’s semiconductor manufacturer MediaTek has unveiled a new 5G smartphone chip in its latest move to bring 5G connectivity to a larger audience.

The Dimensity 700, an octa-core system-on-chip (SoC) built using a 7-nanometer process, adopts 5G Carrier Aggregation and 5G Voice over New Radio (VoNR), the two key technologies that help smartphones increase data speeds and provide higher quality video and phone calls with lower latency respectively, MediaTek said in a statement on Tuesday.

The new chip also features artificial intelligence (AI)-driven camera capabilities including background blurring, face smoothing and color optimization, as well as hardware-based imaging accelerators that allow users to take night photos with low noise, according to the statement.

“With our expanded Dimensity portfolio, we are bringing the latest 5G capabilities to every smartphone tier so more people can enjoy 5G experiences,” said J.C. Hsu, corporate vice president at MediaTek.

In December 2019, Hsinchu-based MediaTek started mass production of the Dimensity 1000, its first 5G mobile chip, which it described as being able to help smartphones accelerate computing speeds and improve energy efficiency relative to its size.

Contact reporter Ding Yi (yiding@caixin.com)

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