Huawei Tests Brute-Force Method for Making More Advanced Chips

(Bloomberg) — Huawei Technologies Co. Ltd. and a state-backed chipmaking partner in China have filed patents for a low-tech but potentially effective way to make advanced semiconductors, raising the prospect that China could improve chip production techniques despite efforts by the United States to halt its progress.

The companies are developing technologies that involve self-aligned quadruple patterning, or SAQP, and should reduce their reliance on high-end lithography, according to patent filings to the Chinese intellectual property authority.