TECH

Huawei Unveils First Mass-Produced Logic-Folding Chip in New Tri-Fold Phone

Published: Sep. 8, 2026 11:49 p.m. GMT+8

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Huawei unveiled the Kirin 9050 Pro chip on Sept. 7, 2026. Photo: VCG

Huawei Technologies Co. Ltd. has unveiled its first mass-produced semiconductor based on a new logic-folding design, debuting the processor in a newly released tri-fold smartphone aimed at boosting computing performance.

The launch underscores the Chinese tech giant is deploying innovative chip-stacking techniques to bypass US export controls on advanced manufacturing equipment and maintain its edge in the premium smartphone market.

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Huawei unveiled Kirin 9050 Pro in Mate XT 2 (19,999 yuan) using logic-folding chip stacking to bypass US export controls on EUV lithography.
Chip has 238 million transistors/sq mm (54% density increase) and boosts device performance by 42%.
Huawei targets 1.4nm-equivalent density by 2031; Counterpoint projects Apple foldable iPhone 25% market share vs Huawei 22% by year-end.

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What Happened When

Monday：: Huawei unveiled the Kirin 9050 Pro processor in the Mate XT 2 Ultimate Design smartphone, priced at 19,999 yuan ($2,980), using its 'Tau Law' logic-folding design.